Color filters, including taking out electrodes or post-ito layer

ABSTRACT

A black matrix 2 and a taking out electrode 3 are formed on a glass substrate 1, using a light-shielding conductive film made of a metal or the like. On this film, an insulating film 4 is formed. At the same time, a taking out electrode window 5 is formed on the portion of the insulating film 4 corresponding to the taking out electrode 3. Then, an electrode for forming a coloring matter layer (ITO electrode) 6 is formed on the insulating film 4. Then, the taking out electrode window 5 is filled with an ITO electrode material, to electrically connect the taking out electrode 3 and the ITO electrode 6. Then the outer electrode was connected to the taking out electrode 3. The electricity was turned on the outer electrode to form a coloring matter layer 8 on the ITO electrode 6.

TECHNICAL FILED

The present invention relates to a color filter and a process forproducing a color filter. The present invention further relates to acolor liquid crystal panel comprising the color filter and a method ofdriving the color liquid crystal panel.

BACKGROUND ART

Color filters prepared by laminating a coloring matter layer on aninsulating substrate are used in a color liquid crystal panel for adisplay of a liquid crystal TV, a personal computer or the like.Heretofore, a color filter having a structure as indicated in FIG. 16,has been known. In the color filter as indicated in FIG. 16, atransparent ITO (Id-Sn oxide) electrode (b) is formed on an insulatingglass substrate (a). On the ITO electrode, coloring matter layers (c)for primary three colors, i.e., R (red), G (green) and B (blue), areformed, and a black matrix (light-shielding film) (d) is formed betweeneach of the coloring matter layers (C). Such black matrix is used toavoid lowering of contrast and color purity due to leaked light. Inaddition, in FIG. 16, (e) denotes a top coating layer and (f) denotes apost-ITO layer.

In general, the coloring matter layers of the color filters are formedby known methods. Such known methods include: a printing method whichcomprises printing inks for three primary colors (RGB) on a glasssubstrate with use of a printing equipment; a dispersion method whichcomprises applying a pigment dispersed in a UV-curable resist on a glasssubstrate, and then forming coloring matter layers for red, green andblue by repeating mask exposure and thermal curing, three times, by wayof a photo-lithography method; a dyeing method which comprises forming aresist layer as a dye preventing layer on a gelatin layer, and dyeingthe gelatin layer to form coloring matter layers for RGB; anelectro-deposition method which comprises forming a dispersion of apigment and an electrodepositing polymer, and subjecting the dispersionto electro-deposition treatment utilizing an electrode formed on thesubstrate; and a micellar disruption method which comprises forming adispersion of a pigment and a surfactant, and subjecting the dispersionto electrolytic treatment utilizing an electrode formed on thesubstrate.

The coloring matter layers of the color filter as shown in FIG. 16 areusually formed by way of an electrical treatment such as anelectro-deposition method or a micellar disruption method (Refer toJapanese Patent Application Unexamined Publication No. 63-243298).

Carbon type photo-resist materials are widely used in the other colorfilter production methods such as a printing method, dispersion methodand dyeing method. However, if such carbon type photo-resist materialsare used in the electrical treatment such as a micellar disruptionmethod or an electro-deposition method, there will be several problemsdue to their conductivity. More specifically, if such a conductiveresist material is used, when a black matrix is first formed and thencoloring matter layers are formed, or when electrodes for formingcoloring matter layers are used to drive liquid crystals, the vicinaltransparent electrodes will be electrically connected through the blackmatrix. Thus, the operations cannot be properly conducted.

Accordingly, in a micellar disruption method or an electro-depositionmethod, as an insulating resist material used for forming a blackmatrix, the insulating material preferably having a surface resistanceof not less than 10⁷ Ω/cm² is used.

As insulating resist material used for forming a black matrix, organicpigment type materials are known.

However, when a black matrix is prepared from an organic pigment typeinsulating resist material, there is a problem that the light-shieldingrate is decreased. This is because a black matrix is formed by way of aphoto-lithography method using a blend of three kinds of a resistmaterial each containing a pigment for red, green or blue.

It is said that as for the light-shielding rate, for example, in thecase of a TFT panel, optical density (OD) should be as high as 3.5 ormore. However, in the case of an organic pigment type resist material,it is difficult to prepare a black matrix having an OD of at least 2.5.

It is desired that a metal black matrix is used as a black matrix havinghigh light-shielding rate. However, in the case of using the metal blackmatrix in a micellar disruption method or an electro-deposition method,there will be the problem as is the same case with the above-mentionedcarbon type resist due to conductivity of the metal black matrix. Inother words, the micellar disruption method and the electro-depositionmethod cannot be used to form a coloring matter film. Also, atransparent electrode for forming a coloring matter film cannot be usedto drive a liquid crystal.

Accordingly the first invention has its object to provide a color filterand its production process which solve the above-mentioned problems,i.e., having a structure wherein the vicinal transparent electrodes arenot electrically connected even when a metal black matrix is used.

Further, the first invention has another object to provide a colorliquid crystal panel and its driving method.

In the meanwhile, a printing method, a dispersion method and a dyeingmethod can form a coloring matter layer in a desired place on a glasssubstrate (e.g., effective display portion) because of their nature inthe production process. However, when a color filter is formed by amicellar disruption method, an electro-deposition method or the likeusing electricity passing treatment as used in the first invention, thefollowing procedure is needed. As shown in FIG. 17, it is necessary toform an electrode 6a for electricity passing treatment by taking out anelectrode in a portion other than an effective display area S(non-effective display area) in order to connect a coloring matter layerforming transparent electrode 6 in the effective display area S to anouter electrode.

Further, as shown in FIGS. 17 and 18, it is required that theelectricity passing treatment should be conducted for an electrode forthe same color, at the same time, among stripe-shaped transparentelectrodes for forming coloring matter layers arranged in the order ofred, green and blue. To do this, the electrodes 6a for the electricitypassing treatment for RGB should be formed such that each electrode 6afor each color should have different length; an insulating film isformed on an electrode taking out window frame 13; an electrode takingout window 14 is formed in the insulating film; then a silver paste 15is applied along with the window for each color in the stripe-shape.Thus, the contact of the electrodes for each color is made.

Further, the present applicant provided in an earlier patent application(Japanese Patent Application No. 241084/89), a technique to simplifythese steps. In such technique, when a black matrix is formed by using alight-shielding resist, an electrode taking out window is formed byusing said resist.

However, in the above-mentioned conventional production process forproducing a color filter, there is a problem that a step of applying asilver paste along with the electrode taking out window in thestripe-shape is required.

Further, when a liquid crystal display is assembled (cell assembling) byusing a color filter, a step of removing the silver paste or a step ofcutting or scrubbing the silver paste portion using a dicer or scrubber,is required.

Furthermore, there is a problem that additional equipments are requiredto remove dusts made at the time of removing the silver paste by vacuumtreatment or the like.

Accordingly, the second invention has its object to provide a colorfilter, its production process, a color liquid crystal panel and itsdriving method, which can omit silver paste applying/removing steps,resulting in improvement of productivity.

DISCLOSURE OF THE INVENTION

The color filter according to the first embodiment of the presentinvention is prepared by laminating a metal black matrix, an insulatingfilm, a transparent electrode and a coloring matter layer, in thisorder, on one side of an insulating substrate.

In the color filter of the first embodiment, the vicinal transparentelectrodes are not electrically connected since there is an insulatinglayer between the metal black matrix and the transparent electrodes.Further, use of the metal black matrix results in high light-shieldingrate (usually OD is at least 3.5) and good contrast. Thus, the colorfilter can be suitably used as a color filter for an active matrix suchas TFT or MIM. Further, since the coloring matter layers and the metalblack matrix are electrically disconnected by the insulating layer, theelectrodes for forming a coloring matter layer can be used as electrodesfor driving a liquid crystal.

Further, a process for producing a color filter according to the fistembodiment of the present invention comprises the following steps (1) to(6):

(1) a step of laminating a metal thin film used for forming a blackmatrix on one side of an insulating substrate;

(2) a step of subjecting the above metal thin film to patterningtreatment to form a black matrix;

(3) a step of laminating an insulating film by covering the above metalblack matrix;

(4) a step of laminating a transparent electrode forming material on theabove insulating film;

(5) a step of subjecting the above transparent electrode formingmaterial to patterning treatment to form a transparent electrode; and

(6) a step of laminating a coloring matter layer on the abovetransparent electrode by way of a coloring matter film forming methodusing an electricity passing treatment.

According to the process of the first invention, a coloring matter layercan be formed by a method using electricity passing treatment such as amicellar disruption method or an electro-deposition method since thetransparent electrodes are not connected to each other. Thus, inaddition to the effect of the metal black matrix, a stable color filterhaving a high light-shielding property, good surface flatness and highcolor purity, and not showing delamination and non-uniform color, can beproduced. Further, according to the process of the first invention, sodalime glass which has not been subjected to polishing, silica coating orthe like can be used as an insulating substrate.

Further, a method of driving the color liquid crystal panel according tothe first invention comprises driving the color liquid crystal panelwith use of transparent electrodes for forming a coloring matter layer.

Further, the color filter according to the second invention is preparedby laminating, in this order, a black matrix and a taking out electrode,an insulating film having a window for a taking out electrode, atransparent electrode for forming a coloring matter layer, an insulatingprotection layer, a coloring matter layer, a flattening film and anelectrode for driving a liquid crystal on an insulating substrate,characterized in that said taking out electrode and the transparentelectrode for forming a coloring matter layer are electrically connectedthrough said window for a taking out electrode.

Furthermore, a process for producing a color filter according to thesecond invention comprises: forming and laminating, in this order, ablack matrix, a taking out electrode and an insulating film having awindow for a taking out electrode; forming a transparent electrode forforming a coloring matter layer on the insulating layer in such mannerthat the transparent electrode can be electrically connected to thetaking out electrode through the widow for a taking out electrode; andthen forming a coloring matter layer by passing electricity to thetransparent electrode for forming a coloring matter layer through thetaking out electrode. Preferably, the exposure and development time forthe photo-lithography treatment is controlled to form the peripheryportion of the taking out electrode window of the insulating film in thetaper shape.

Further, a color liquid crystal display according to the secondinvention is composed of the above-mentioned color liquid crystal panel,an electrode substrate for driving a liquid crystal and a liquid crystalencapsulated between them.

According to the color filter and the color liquid crystal display ofthe second invention, the silver paste applying and removing steps canbe omitted. Thus, the process can be simplified.

In addition, according to the production process of a color filter ofthe second invention, the color filter according to the second inventioncan be effectively produced.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view of one example of the color filteraccording to the first invention; FIG. 2 is a cross-sectional view ofanother example of the color filter according to the first invention;FIG. 3 is a plan view showing a mask for forming a transparentelectrode; FIG. 4 is a plan view showing a mask for forming a blackmatrix and an electrode taking out zone; FIGS. 5 and 6 arecross-sectional views of an electrode taking out zone; FIG. 7 shows astructure of the color filter according to the second invention; FIG. 8is a partially cross-sectional view showing a structure of the colorfilter according to the present invention; FIG. 9 shows steps of aprocess for producing the color filter according to one example of thesecond invention; FIGS. 10 and 11 are plan views showing a mask used inthe steps as shown in FIG. 9; FIG. 12 is a cross-sectional view showinga situation wherein the electrode taking out window is formed in thetaper shape; FIG. 13 shows another mask used in the steps as shown inFIG. 9; FIG. 14 is a cross-sectional view of a color liquid crystaldisplay; FIG. 15 shows steps of a process for assembling a color liquidcrystal display; FIG. 16 is a cross-sectional view showing a structureof a conventional color filter; FIG. 17 is a plan view showing astructure of a color filter; and FIG. 18 is a cross-sectional viewshowing a structure of a color filter.

MOST PREFERRED EMBODIMENTS CARRYING OUT THE INVENTION

The first invention will be described in more detail with reference tothe attached drawings.

FIG. 1 shows one example of a color filter according to the firstinvention. The color filter is made useful for driving MIM or STN.

In the color filter, 1 denotes an insulating substrate. A metal blackmatrix 2 which has been subjected to patterning is formed on one side ofthe substrate 1, and an insulating film 4 is laminated to cover theblack matrix. Further, transparent electrodes 6 which have beensubjected to patterning, are formed on the insulating layer 4. Coloringmatter layers 8 for RGB primary colors are formed on the transparentelectrodes 6. Further, a top coating layer 11 is laminated on thecoloring matter layers 8. A post-ITO layer 12 which has been subjectedto patterning, is formed on the top coating layer 11.

FIG. 2 shows another example of the color filter according to the firstinvention. The color filter is made useful for driving TFT. In the colorfilter, an insulating substrate 1, a metal black matrix 2, an insulatingfilm 4, transparent electrodes 6 and coloring matter layers 8 are thesame as those in FIG. 1. In this example, a top coating layer is notformed, and a post-ITO layer 12 which has not been subjected topatterning is laminated on the coloring matter layers 8. 0f course, atop coating layer can be formed.

In addition, the above-mentioned color filter is used for driving MIM,STN or TFT. However, it is possible that the structure can be modifiedin several ways depending upon the intended use or the like within thespirit of the present invention.

Next, the process for producing a color filter of the first inventionwill be explained in the order of the steps (1) to (6).

(1) A thin metal film used for forming a black matrix is laminated onone side of an insulating substrate.

In this case, as an insulating substrate, a glass substrates such assoda lime glass, non-alkali glass can be preferably used. In addition,as soda lime glass, non-polished products as well as polished productscan be used. More specifically, recently a soda lime glass substrate isusually subjected to polishing treatment (mirror polishing) if used as aliquid crystal panel, because the scratches on the soda lime glasssurface cause braking of electrode lines at the time of ITO patterning.Also, soda lime glass is usually subjected to a silica coating treatmentbecause the alkali elution causes shortening of the life of the liquidcrystal. On the contrary to this, in the present invention, thetreatment to the soda lime glass (polishing, silica dipping) is notrequired because the black matrix and the insulating film can avoid thealkali elution, and flatten the surface.

Further, metals for the black matrix are not particularly limited, butchromium or nickel is preferably used.

As a method of forming a thin metal film, sputtering, vapor deposition,CVD or the like can be mentioned.

(2) The above-mentioned thin metal film is subjected to patterning toform a black matrix.

In this case, patterning methods are not limited to, but include, forexample, a method comprising conducting resist application by a rollcoater or a spin coater; exposure treatment with a stepper exposingequipment or a one-shot exposing equipment; development; etching; andresist removal in this order.

(3) An insulating film is laminated to cover the above-mentioned thinmetal black matrix.

In this case, the materials for the insulating film are not limited to,but preferably include, for example, silica, titania, alumina and aninsulating polymer.

Examples of methods of forming the insulating film are, for example, amethod of sputtering silica, titania or alumina, a method of dipping insilica and a method of coating an insulating polymer.

(4) A transparent electrode forming material is laminated on theabove-mentioned insulating film. In this case, examples of thetransparent electrode forming materials are ITO and tin oxide. Examplesof a method of laminating the transparent electrode forming material area sputtering method, a vapor deposition method and a pyro-sol method.

(5) A transparent electrode is formed by subjecting the above-mentionedtransparent electrode forming material to patterning.

In this case, examples of a method of patterning can be the same asthose previously described for the above-mentioned step (2).

(6) A coloring matter layer is laminated on the above-mentionedtransparent electrode.

In this case, as a method of forming a coloring matter layer, a methodusing electricity passing treatment, particularly a micellar disruptionmethod or an electro-deposition method, can be preferably used.

To form the above coloring matter thin film by a micellar disruptionmethod, the following procedures can be used. A micelle forming agentcomprising ferrocene derivatives and a coloring matter material(hydrophobic coloring matter) are added to an aqueous solvent having acontrolled conductance prepared by adding, as necessary, a supportelectrolyte to water. The mixture is well stirred to obtain a micellecontaining the coloring matter material therein. When the micellesolution is subjected to electrolytic treatment, the micelle moves to ananode. The ferrocene derivative contained in the micelle loses anelectron, e⁻ (Fe²⁺ of the ferrocene is oxidized to Fe³⁺) on the anode(transparent electrode), and at the same time the micelle is broken.When the micelle is broken, a coloring matter material is precipitatedon the anode to form a thin film.

On the other hand, the oxidized ferrocene derivative moves to a cathodeand receives an electron, e⁻ to reform a micelle. While the micelleformation and breakage are repeated, coloring matter particles areprecipitated on the transparent electrode to form a thin film. Thedesired coloring matter thin film is formed in this manner. The thusobtained coloring matter thin film has, in general, a thickness of 0.1to 10.0 μm, preferably 0.1 to 2.0 μm. Due to the porous structure of thethin film, the thin film has high conductance.

If the film thickness is less than 0.1 μm, the hue of the coloringmatter layer cannot sufficiently be exhibited. If the thickness is morethan 10.0 μm, the film will have low conductance. Thus, the thin filmhaving the above thickness range is preferable.

In the case of forming coloring matter films for three primary colors bythe above-mentioned micellar disruption method, any one of red, greenand blue hydrophobic coloring matters is first added to an aqueousmedium, and the first desired color thin film is formed by theabove-mentioned micellar disruption method. Then, the micelleelectrolytic treatment is repeatedly carried out by using differenthydrophobic coloring matter to form coloring matter films for the threeprimary colors (red, green, blue) on each transparent electrode. Inaddition, it is possible to get hydrophobic coloring matters for red,green and blue dispersed in an aqueous medium at the same time, andsubject the aqueous medium to the micelle electrolytic treatment toproduce the similar coloring matter films.

In the production process according to the present invention, inaddition to the above-mentioned steps, the following steps (7) to (9)can be conducted.

(7) An electrode taking out zone can be formed in the color filter byusing an insulating resist material and an electrically conductivematerial before or after the formation of the coloring matter films.According to this step, a color filter capable of using transparentelectrodes for forming a coloring matter layer as electrodes for drivingcrystal liquids, can be readily produced.

For example, if patterning of a transparent electrode is conducted byusing a mask 100 as shown in FIG. 3 in the above-mentioned step (5), 10sets of three electrode lines (i.e., the shortest line 6B, the middlelength line 6G and the longest line 6R) can be formed. The three lines6B, 6G and 6R correspond to three primary colors for light, i.e., blue(B), green (G) and red (R), respectively.

An insulating layer for taking out an electrode is formed with aninsulating resist material and a mask 101 as shown in FIG. 4. The mask101 has not only a black matrix pattern 2, but also an electrode takingout zone pattern 13. The pattern 13 comprises patterns for forming threesets of electrode taking out window belts. In other words, the pattern13 comprises a pattern 14B for forming an electrode taking out windowbelt for electrode lines (B), a pattern 14G for forming an electrodetaking out window belt for electrode lines (G) and a pattern 14R forforming an electrode taking out window belt for electrode lines (R).Further, electrically conductive layers for taking out electrodes areformed by using an electrically conductive material.

FIGS. 5 and 6 show an electrode taking out zone of a color filterproduced by using a mask 100 and a mask 101. FIG. 5 is a cross-sectionalview of a color filter, taken along the V--V line of a mask 101. FIG. 6is a cross-sectional view of a color filter, taken along the VI--VI lineof a mask 101. As shown in FIGS. 5 and 6, the electrode lines 6G and 6Rare coated with an insulating layer 13. The electrode lines 6B areelectrically connected to each other through an electrically conductivelayer 15.

In addition, the insulating resist materials for forming the insulatinglayer usually include a negative type UV sensitive resist. Theelectrically conductive materials for forming the electricallyconductive layers include, for example, an electrically conductive thinfilm and electrically conductive paste.

(8) If necessary, like the color filter as shown in FIG. 1, a topcoating material may be coated with a spin coater or a roll coater onthe coloring matter layer and dried at 80° to 150° C. for 5 to 60minutes to form a top coating layer. The top coating material include,for example, an acrylic resin, polyether resin, polyester resin,polyolefin resin, phosphazene resin, or polyphenylene sulfide resin. Ifthe coating layer is prepared from a conductive material, voltage downdue to the coating layer can be prevented, and the electrodes forforming a coloring matter layer can be effectively used as electrodesfor driving a liquid crystal.

(9) If necessary, like the color filter as shown in FIGS. 1 and 2, apost-ITO layer is formed on a top coating layer (FIG. 1) or a coloringmatter layer (FIG. 2). The post-ITO layer functions as an electrode fordriving a liquid crystal separately from the electrode for forming acoloring matter layer. In addition, in the case of producing a colorfilter for driving MIM or STN, a post-ITO is subjected to patterning(FIG. 1).

The color liquid crystal panel according to the present invention isproduced using the above-mentioned color filter. In this case, a meansfor producing a panel is not limited. However, the following method canbe preferably used.

First, an orientation layer is formed by coating, for example, apolyamic acid monomer, a polyimide resin oligomer or the like by a spincoater or a roll coater on a color filter, polymerizing the coatedmaterial at 200° to 300° C. for 30 minutes to 2 hours, washing with purewater or the like, and drying the polymerized product (at 60° to 100° C.for 30 minutes to 2 hours or by IR radiation or the like). The liquidcrystals can be oriented by the orientation layer. Then, a color filteris fixed to a driving electrode substrate such as TFT, MIM (activematrix) and DUTY (simple matrix) using a spacer made of glass beads orplastics and an encapsulating agent such as adhesive, and then subjectedto rubbing treatment such as abrasion rubbing or oblique evaporation.Simultaneously, a liquid crystal such as TN, STN, FLC, AFLC or VAN ispored, by vacuum poring or the like, between the driving electrodesubstrate and the color filter.

According to the method of driving a color liquid crystal panel of thepresent invention, a color liquid crystal panel is driven by atransparent electrode used to form a coloring matter layer. In thiscase, as a driving circuit, desired ones such as MIM and TFT can be useddepending upon the kind of the color filter used. Further, in this case,a post-ITO is not formed.

Next, the second invention will be described in more detail withreference to the attached drawings.

FIG. 7 is a cross-sectional view showing a color filter according to thepresent invention. FIG. 8 is a partially plan view of the same.

In the color filter according to the second invention, as shown in FIGS.7 and 8, a black matrix 2 and taking out electrodes 3 are formed on aninsulating substrate 1. The black matrix 2 and the taking out electrodes3 are composed of a light-shielding conductive film such as chromium andnickel.

On the black matrix 2 and the taking out electrodes 3, an insulatingfilm 4 is formed, and a taking out electrode window 5 is formed in theportion of the insulating film 4, said portion corresponding to thetaking out electrodes 3.

On the insulating film 4, the transparent electrodes for forming acoloring matter layer are formed. The transparent electrodes 6 forforming a coloring matter layer and the taking out electrodes 3 areelectrically connected through the taking out electrode window 5. Theelectrical contact can be made by filling an electrically conductivematerial in the taking out electrode window 5.

An insulating protection film 7 is formed on the insulating substrate 1having the transparent electrodes 6 for forming a coloring matter layerthereon, provided that the insulating protection film 7 is not formed onthe portion of the substrate corresponding to the effective display areaS. The insulating protection film 7 is formed on the substrate beforecoloring matter layers are formed.

The electricity passing electrodes 6a located on the portion of theinsulating substrate 1 corresponding to the non-effective display areaS, are formed and protected by the insulating protection film 7 as shownin FIG. 7. Thus, when coloring matter layers 8 are formed by passingelectricity through the electrodes for forming a coloring matter layer,the coloring matter layers are formed on the portion of the electricitypassing electrode 6a corresponding to the non-effective display area,resulting in flat surface of the substrate. Further, the color filter 1and a driving electrode substrate to be bonded thereto can be readilyand completely bonded because the bonding portions therefor can be atthe same level. This results in improvement of durability.

On the substrate having the above-mentioned coloring matter layer formedthereon, a flattening film and a liquid crystal driving electrode arelaminated in this order.

The materials for each element of the color filter according to thesecond invention and a method of forming each element will be describedlater.

In addition, the color filter according to the second invention includesa substrate for producing a color filter comprising at least blackmatrix, a taking out electrode, an insulating film having an electrodetaking out window and a coloring matter layer forming electrode on aninsulating substrate.

Next, the process for producing a color filter according to the secondinvention will be described.

The process for producing a color filter according to the secondinvention is characterized by forming and laminating, in this order, ablack matrix, a taking out electrode and an insulating film having awindow for a taking out electrode; forming a transparent electrode forforming a coloring matter layer on the insulating layer in such mannerthat the transparent electrode can be electrically connected to thetaking out electrode through the widow for a taking out electrode; andthen forming a coloring matter layer by passing electricity to thetransparent electrode for forming a coloring matter layer through thetaking out electrode.

FIG. 9 is a flow chart showing the first embodiment of the process forproducing a color filter according to the second invention. In addition,a color filter to be produced by this example is the same as that shownin FIG. 7.

(1) A color filter is formed on a glass substrate 1. Glass substrateswhich can be preferably used include, for example, soda lime glass (blueplate), low expansion glass, non-alkali glass (NA) and quartz glass.Polished glass is preferable, but non-polished ones can be used.

(2) A thin metal film is formed on the above glass substrate 1. The thinmetal film is formed on the glass substrate by a sputtering method,vapor deposition method, CVD method or the like, using a metal such aschromium (Cr) and nickel (Ni). The thin metal film should have alight-shielding property and conductivity. In addition, it is preferableto form a SiO₂ coating on the glass substrate and then form a thin metalfilm on the coating in order to improve adhesiveness between the thinmetal film and the glass substrate.

(3) Patterning of the thin metal film formed on the glass substrate iscarried out by a photo-lithography method, to form a black matrix 2 anda taking out electrode 3 at the same time. The pattering of the thinmetal film by a photo-lithography method is carried out in the order of(1) resist application, (2) exposure, (3) development, (4) post-baking,(5) etching of the thin metal film and (6) resist removal. In addition,for the exposure, a mask 102 for forming a black matrix 2 and a takingout electrode 3 as shown in FIG. 10, is used.

(4) An insulating film is formed on the glass substrate on which theblack matrix is formed. The insulating film is formed by application ofa resist material composed of at least one resin selected from anacrylic resin having sensitivity to ultra-violet ray, an epoxy resin anda siloxane resin, by a spin coater or a roll coater. Then, a taking outelectrode window 5 is formed in the insulating film by aphoto-lithography method.

For the formation of the taking out electrode window 5, a designed mask103 for forming the taking out electrode window as shown in FIG. 11, isused.

In addition, when the taking out electrode window 5 is formed by aphoto-lithography, it is preferable to form the periphery portion of thetaking out electrode window 5 in the taper shape as shown in FIG. 12 bycontrolling the process conditions such as development time, in order todrastically reduce braking off of lines and pin holes of the ITO to beformed on the taking out electrode window.

(5) An ITO thin film is formed on the insulating film.

The ITO film can be formed by way of a sputtering method, a vapordeposition method, a pyro-sol method or the like. When the ITO thin filmis formed, the ITO is filled in the taking out electrode window 5 toelectrically connect the taking out electrodes 3 and the ITO film.

(6) An ITO electrode 6 is formed by subjecting the above-mentioned ITOthin film to patterning by a photo-lithography method. According to thisstep, a series of ITO electrodes for each color connected by the takingout electrode 3 are formed. The patterning by a photo-lithography methodis the same as that used in the above-mentioned step (3). In addition,the ITO electrode 6 is used as a coloring matter layer formingelectrode. The pattern is usually in the shape of stripes.

(7) An insulating protection layer 7 is formed on the portion of the ITOpatterning glass substrate with the black matrix which is notcorresponding to the effective display area. As used herein, theeffective display area means a portion which constitutes a liquidcrystal display portion wherein a liquid crystal is encapsulated. Amethod of forming an insulating protection film 7 in the place where theeffective display area is not located (non-effective display area), isnot particularly limited. For example, in the case of using aphoto-lithography method, the insulating protection film can be formedonly in the non-effective display area, by a method comprising applyinga positive resist on an ITO patterning glass substrate (all surface)with a spin coater or a roll coater, subjecting the substrate toexposure treatment with a mask 104 having a shielding portioncorresponding to effective display area S as shown in FIG. 13, anddissolving and removing the resist coated on the portion correspondingto the effective display portion S by development.

In addition, as shown in FIG. 13, if a pattern for forming an electrodetaking out portion 9 is additionally made on the mask 104, the electrodetaking out portion 9 and the insulating protection film can besimultaneously formed.

In the case of using an offset printing, the insulating protection filmis formed by printing a resin oligomer in the non-effective displayarea, and then polymerizing the oligomer by application of heat.

The materials for the above-mentioned insulating protection film, in thecase of using a photo-lithography method, include, a resist materialcontaining at least one resin selected from an acrylic resin havingsensitivity to ultra-violet ray, an epoxy resin and a siloxane resin. Inthe case of forming the insulating protection film by an offsetprinting, the materials include a thermosetting resin (resin oligomer)comprising as main component at least one resin selected from an acrylicresin having sensitivity to a ultra-violet ray, an epoxy resin and asiloxane resin.

(8) After formation of the above-mentioned insulating protection film,each coloring matter layer (film) 8 for R (red), G (green) or B (blue)is formed. The formation of the coloring matter layer is carried out bya micellar disruption method, an electro-deposition method or the like.

The micellar disruption method comprises immersing a substrate in amicelle solution containing a coloring matter, connecting a potentiostat(outer electrode) to taking out electrodes 3, passing electricity to ITOelectrodes (coloring matter layer forming transparent electrodes) 6 toconduct fixed voltage electrolytic treatment, to form the coloringmatter layers (films) 8 on the ITO electrodes 6. In this case, theformation of the coloring matter layers is conducted for each colorusing a micelle solution for each color.

An electro-deposition method comprises dispersing a depositing polymerand a pigment, and forming a coloring matter layer by anelectro-deposition coating method with use of the ITO electrode.

(9) After formation of the coloring matter layers, a flattening film(top coating film) is formed on the coloring matter layers. The topcoating film is formed by coating a polymer by a spin coating method,and then post-baking the coated polymer.

(10) On the above-mentioned top coating film, a post-ITO electrode isformed. The post-ITO electrode is formed in the same manner as in theabove-mentioned steps (5) and (6). In addition, a pattern usually has astripe pattern which is vertical to the stripe pattern for the ITOelectrodes previously formed.

A color filter is produced according to the above-mentioned process.

Next, a color liquid crystal display using the color filter as producedabove and its assembling process will be described below.

As shown in FIG. 14, a liquid crystal panel is produced by gluing acolor filter substrate 10 and a liquid crystal driving electrodesubstrate 20 with a spacer 40, and then encapsulating a liquid crystal30 between them. The color filter 10 is produced by forming coloringmatter layers 8 for three primary colors (R, G, B) respectively on aglass substrate 1, forming a black matrix 2 which avoids decrease incontrast and color purity due to leakage of light between the coloringmatter layers, applying a top coating material 11 to flatten thesurface, and then forming transparent electrodes 12 on the top coatingmaterial. The driving substrate 20 is composed of a glass substrate 21and a driving transparent electrode 22 formed thereon.

FIG. 15 shows a process for assembling a color liquid crystal displayaccording to the present invention.

(1) A liquid crystal driving electrode substrate is composed of a glasssubstrate and a liquid crystal driving transparent electrode formedthereon. In the case of the simple matrix system, belt-shapedtransparent electrodes are formed, and a liquid crystal for each pictureelement is driven by time-sharing from outside. In the case of theactive matrix system, for each picture element, a picture element and amatrix array are formed, and a liquid crystal for each picture elementis driven by the each matrix array. As non-linear device used as amatrix array, a three terminal type thin film transistor (TFT) and a twoterminal type metal-insulator-metal (MIM) are used.

(2) As a color filter, the above-mentioned color filter according to thepresent invention can be used.

(3) A spacer is used to keep thickness of a liquid crystal layer at afixed level. The spacer is made of a Teflon film or mica film. Inaddition, in the case of producing a display panel with wide displayarea, glass beads, plastic beads or the like are sometimes dispersed inthe panel.

(4) As adhesive (encapsulation material), an organic adhesive (such asan epoxy resin based adhesive) and an inorganic adhesive (such as glasssolder) can be mentioned. Preferred is an adhesive having goodadhesiveness to the insulating protection film formed in thenon-effective display area.

(5) Rubbing is made of substrate surface treatment to make uniformmolecule arrangement. Depending upon the display system, a parallelorientation treatment or a vertical orientation treatment is used. Morespecifically, abrasion rubbing, oblique evaporation or the like can bementioned.

(6) As a method of encapsulating a liquid crystal, a method usingsurface tension and a method using pressure difference can be mentioned.A vacuum encapsulation method using pressure difference is preferable toavoid forming of bubbles and deterioration.

A liquid crystal to be encapsulated is selected depending upon thedisplay mode. The display mode includes, for example, TN, STN, FLC, AFLCand VAN.

(7) As a method of connecting an electrode and a driver IC, a tip onflexible printed circuit (COF), a tip on glass (COG) or the like can bementioned.

(8) The color liquid crystal panel (display) according to the presentinvention is produced by following the above-mentioned procedures. Theliquid crystal panel is driven with an alternating current. The liquidcrystal panel can be driven by the liquid crystal driving electrodeformed on the flattening film of the color filter as mentioned above.However, it is also possible to drive the liquid crystal panel with useof a coloring matter layer forming electrode as a driving electrode,without forming the liquid crystal driving electrode on the flatteningfilm.

The present invention will be described in more detail with reference tothe following examples. However, the present invention is not limited tothe following examples.

EXAMPLE 1 (First Invention)

A color filter and a color liquid crystal panel were produced in thefollowing manner.

I. Production of Color Filter Formation of Black Matrix

A thin chromium film having a thickness of about 2,000 Å was laminated,by sputtering, on a soda lime glass substrate (300 mm ×300 mm) which hadnot been subjected to mirror polishing treatment and silica dippingtreatment. As a sputtering equipment (SDP-550VT: manufactured by Alback)was used. The same equipment was used throughout the following Examples.

On this substrate, a UV-curable resist material (IC-28/T3: manufacturedby Fuji Hunt Electronics Technology) was coated by spin coating at 1000rpm. After spin coating, the obtained substrate was pre-baked at 80° C.for 15 minutes. Then, this resist/Cr/glass substrate was set in astepper exposure equipment. The step-exposure was conducted with a maskprepared by dividing into four pieces a grid pattern having a pictureelement size of 90 μm ×310 μm, a gap of 20 μm and an effective area of160 mm ×155 mm. The exposure capacity was 10 mW/cm².S and the scanningspeed was 5 mm/sec. Then, the development was conducted by an alkalideveloping liquid. After development, the obtained substrate was rinsedwith pure water, and post-baked at 150° C. Thereafter, the chromium onthe substrate was subjected to etching treatment with an aqueoussolution of 1M FeCl₃ /6N HCl/0.1N HNO₃ /0.1N Ce(NO₃)₄ as an etchingliquid. The ending point of the etching was measured by electricresistance. The etching took about 20 minutes. After etching, thesubstrate was rinsed with pure water and the resist was removed with 1NNaOH. The substrate was sufficiently washed with pure water to completea black matrix.

Formation of Insulating Film and ITO Thin Film

Then, on the above-mentioned black matrix, a silica layer having athickness of about 1500 Å was formed by sputtering as an insulatingfilm. Further, on the silica layer, an ITO layer having a thickness ofabout 1300 Å was laminated. At this time, the ITO/SiO₂ /Cr/glasssubstrate was heated to 250° C. to adjust the surface resistance of theITO to 20 Ω/cm².

On the ITO/SiO₂ /Cr/glass substrate, a UV-curable resist material(IC-28/T3) was coated by spin coating at 1,000 rpm. After spin coating,the substrate was pre-baked at 80° C. for 15 minutes. Thereafter, theresist/ITO/SiO₂ /Cr/glass substrate was set in a contact exposingequipment (exposure capacity: 10 mW/cm²). A mask used had a stripepattern having a line width of 90 μm, a gap of 18 μm and a line lengthof 155 mm. As light source, a 2 kW high pressure mercury lamp was used.After alignment, the substrate was subjected to exposure treatment for15 seconds with a proximity gas of 50 μm. Then, the development wascarried out with an alkali developing liquid. After development, thesubstrate was rinsed and post-baked at 150° C. Thereafter, the above ITOwas subjected to etching treatment with an aqueous solution of 1M FeCl₃/1N HCl/0.1N HNO₃ /0.1N Ce(NO₃)₄ as an etching liquid. The ending pointof the etching was measured by electric resistance. The etching tookabout 40 minutes. After etching, the substrate was rinsed with purewater and the resist was removed with 1N NaOH. Further, the substratewas washed with pure water to complete a substrate having a black matrixfor forming a coloring matter layer. The completion of the substrate wasconfirmed by checking that there is no electric leakage among ITOelectrodes.

Formation of Coloring Matter Layers

A 10 percent celsolve acetate solution containing an acrylic type resistmaterial (manufactured by Toa Gosei) was used as a resist material fortaking out an electrode. The ITO patterning glass substrate with the Crblack matrix prepared was rotated at 10 rpm, and 30 cc of theabove-mentioned resist material were sprayed on the substrate. Then, therotation speed was raised to 1,500 rpm to uniformly form a resist layeron the substrate. The substrate was pre-baked at 80° C. for 15 minutes.Then, the substrate was subjected to exposure treatment using a maskhaving a designed pattern for taking out electrodes (FIG. 4), whilepositioning was made by a contact exposing equipment having alignmentcapability with a 2 kW high pressure mercury lamp. Thereafter, thesubstrate was developed for 30 seconds with a developing liquid (CD:manufactured by Fuji Hunt Electronics Technology) which had been dilutedfour times by pure water. Further, the substrate was rinsed with purewater and post-baked at 200° C. for 100 minutes. Then, a silver pastewas coated with a dispenser.

To 4L pure water, a ferrocene derivative micelle forming agent, EPEG(manufactured by Dojin Kagaku), LiBr (manufactured by Wako Junyaku) andCHLOMOFUTAL A2B (manufactured by Chiba-Geigy) were added to prepare 2mM, 0.1M, and 10 gl/l solution, respectively. Each of the obtainedsolution was stirred by an ultrasonic homogenizer for 30 minutes(micelle solution). The above substrate with the black matrix wasimmersed in the micelle solution and a potentiostat was connected to Rlines of the stripes. The fixed voltage electrolytic treatment at 0.7 Vwas conducted to obtain a red coloring matter layer. After washing withpure water, the substrate was pre-baked at 180° C. with an oven. Thesame procedures for formation of the red coloring matter layer wererepeated to obtain green and blue coloring matter layers except that 15g/l of Heliogen Green L9361 (manufactured by BASF) for green, and 9 g/lof Heliogen Blue B7080 (manufactured by BASF) for blue were used.Finally, the silver paste and the resist for taking out electrodes wereremoved by an alkali solution, and then completely removed with anacetone solution by application of ultrasonic wave.

Formation of Top Coating Layer

Then, 30 cc of a top coating material (JSS7265) were sprayed on theprepared color dividing filter substrate, while the substrate wasrotated at 10 rpm. Then, the rotation speed was raised to 1,500 rpm toform a uniform layer. The substrate was post-baked at 220° C. for 100minutes to form a top coating layer. Thus, an RGB color filter substratewas obtained.

Formation of Post-ITO Layer

On the above top coating layer, an ITO having a thickness of about 1,300Å was formed by sputtering. At this stage, the color filter substratewas heated to 120° C., while introducing steam and oxygen, to adjust thesurface resistance of the ITO to 20 Ω/cm².

Then, on the ITO, a UV-curable resist material (IC-28/T3) was coated byspin coating at 1,000 rpm. After spin coating, the substrate waspre-baked at 80° C. for 15 minutes. Thereafter, the resist/post-ITO/RGBcolor filter substrate was set in a contact exposing equipment (exposurecapacity: 10 mW/cm²). A mask used had a stripe pattern (vertical to thestripe pattern for forming a black matrix) having a line width of 312μm, a gap of 18 μm and a line length of 175 mm. As light source, a 2 kWhigh pressure mercury lamp was used. After alignment, the substrate wassubjected to exposure treatment for 15 seconds with a proximity gas of50 μm. Then, the development was carried out with an alkali developingliquid. After development, the substrate was rinsed and post-baked at180° C. Thereafter, the above ITO on the substrate was subjected toetching treatment with an aqueous solution of 1M FeCl₃ /1N HCl/0.1N HNO₃/0.1 N Ce(NO₃)₄ as an etching liquid. The ending point of the etchingwas measured by electric resistance. The etching took about 23 minutes.After etching, the substrate was rinsed with pure water and the resistwas removed with 1N NaOH. Thus, the patterning of the ITO was completedto obtain a color filter for STN or MIM.

II. Production of Color Liquid Crystal

On the surface of the color filter prepared, a polyamic acid resinmonomer was coated by spin coating. The monomer was cured at 250° C. for1 hour to obtain a polyimide resin, and then subjected to rubbingtreatment. As a counter electrode, a polyamic acid resin monomer wascoated by spin coating on the ITO glass substrate with a MIM drivingcircuit. The monomer was cured at 250° C. for 1 hour to obtain apolyimide resin. After rubbing was made, between this substrate and theabove color filter, glass beads and a TN liquid crystal were inserted inthis order, and encapsulated by adhesive to complete a panel.

Example 2 (First Invention)

The procedures of Example 1 were repeated to prepare a color filter anda liquid crystal panel, except that a thin nickel film having athickness of about 1,500 Å was formed by sputtering instead of the thinchromium film.

Example 3 (First Invention)

The procedures of Example 1 were repeated to prepare a color filter anda liquid crystal panel, except that a thin silica film having athickness of about 1,000 Å was formed by dipping treatment and baking at250° C. for 1 hour instead of sputtering.

Example 4 (First Invention)

The procedures of Example 1 were repeated to prepare a color filter anda liquid crystal panel, except that a thin alumina film having athickness of about 1,000 Å was formed by sputtering instead of silica.

Example 5 (First Invention)

The procedures of Example 1 were repeated to prepare a color filter anda liquid crystal panel, except that an insulating under coating wasformed using a top coating material (JSR7265: manufactured by JapanSynthetic Rubber) instead of sputtering of silica.

In this case, 30 cc of a top coating material diluted by ethyl celsolvetwice were sprayed on the glass substrate at 10 rpm. Then, the rotationspeed was raised to 1,500 rpm to form a uniform layer. The substrate Waspost-baked at 220° C. for 100 minutes to form an under coating layer.

Example 6 (First Invention)

The procedures of Example 1 were repeated to prepare a color filter anda liquid crystal panel, except that an insulating under coating wasformed by using a top coating material (OS-808: manufactured by NagaseIndustry) instead of sputtering of silica.

In addition, the formation of the under coating layer was conducted inthe same manner as in Example 5.

Example 7 (First Invention)

The procedures of Example 1 were repeated to prepare a color filter anda liquid crystal panel, except that a titania film having a thickness ofabout 2,200 Å was formed by sputtering instead of sputtering of silica.

Example 8 (First Invention)

The procedures of Example 5 were repeated to prepare a color filter forTFT, except that a top coating film was not formed; a post-ITO wasdirectly laminated on the coloring matter layer; and the patterning ofthe post-ITO was not conducted.

Further, a liquid crystal panel for TFT was produced by combining thiscolor filter with a TFT driving substrate.

Example 9 (First Invention)

The procedures of Example 8 were repeated to prepare a color filter anda liquid crystal panel, except that a non-alkali glass (NA45:manufactured by HOYA: 300 mm ×300 mm) was used instead of soda limeglass as a substrate glass.

Comparative Example 1 (First Invention)

A color filter and a color liquid crystal panel were produced in thefollowing manner.

I. Production of Color Filter Formation of ITO Electrode

A solution prepared by diluting a UV-curable resist material (IC-28/T3)twice with xylene, was coated by spin coating at 1,000 rpm on a glasssubstrate having a surface resistance of 20 Ω/cm² (NA45: manufactured byHOYA: 300 mm ×300 mm) as an ITO film. After spin coating, the substratewas pre-baked at 80° C. for 15 minutes. Thereafter, the resist/ITOsubstrate was set in a one-shot exposing equipment (exposure capacity:10 mW/cm²). A mask used had a stripe pattern having a line width of 100μm, a gap of 20 μm and a line length of 155 mm. As light source, a 2 kWhigh pressure mercury lamp was used. After alignment, the substrate wassubjected to exposure treatment for 15 seconds with a proximity gas of70 μm. Then, the development was carried out with an alkali developingliquid. After development, the substrate was rinsed and post-baked at180° C. Thereafter, the above ITO was subjected to etching treatmentwith an aqueous solution of 1M FeCl₃ /1N HCl/0.1N HNO₃ /0.1N Ce(NO₃)₄ asan etching liquid. The ending point of the etching was measured byelectric resistance. The etching took about 40 minutes. After etching,the substrate was rinsed with pure water and the resist was removed with1N NaOH.

Formation of Black Matrix

Then, a mixture containing a resist, CK (manufactured by Fuji HuntElectronics Technology) and a 10 percent solution of an acrylic typeresist (manufactured by Toa Gosei) at a weight ratio of 3:1, was used asa resist material for forming a black matrix. The ITO patterning glasssubstrate prepared as above was rotated at 10 rpm, and 30 cc of theabove-mentioned resist material were sprayed on the substrate. Then, therotation speed was raised to 2,500 rpm to uniformly form a resist layeron the substrate. The substrate was pre-baked at 80° C. for 15 minutes.Then, the substrate was subjected to exposure treatment using a maskhaving a designed pattern for taking out electrodes (FIG. 4), whilepositioning was made by a contact exposing equipment having alignmentcapability with a 2 kW high pressure mercury lamp. Thereafter, thesubstrate was developed for 30 seconds with a developing liquid (CD)which had been diluted four times by pure water. Further, the substratewas rinsed with pure water and post-baked at 200° C. for 100 minutes.

Formation of Coloring Matter Layers

To 4L pure water, a ferrocene derivative micelle forming agent, EPEG(manufactured by Dojin Kagaku), LiBr (manufactured by Wako Junyaku) andCHLOMOFUTAL A2B (manufactured by Chiba-Geigy) were added to prepare 2mM, 0.1M, and 10 gl/l solution, respectively. Each of the obtainedsolution was stirred by a ultrasonic homogenizer for 30 minutes (micellesolution). The above substrate with the black matrix was immersed in themicelle solution and a potentiostat was connected to R lines of thestripes. The fixed voltage electrolytic treatment at 0.5 V was conductedto obtain a red coloring matter layer. After washing with pure water,the substrate was pre-baked at 180° C. with an oven. The same proceduresfor formation of the red coloring matter layer were repeated to obtaingreen and blue coloring matter layers except that 15 g/l of HeliogenGreen L9361 (manufactured by BASF) for green, and 9 g/l of Heliogen BlueK7080 (manufactured by BASF) for blue were used. Thus, coloring matterlayers for RGB were obtained.

Formation of Top Coating Layer

Then, 30 cc of a top coating material (JSS7265) were sprayed on theprepared color dividing filter substrate, while the substrate wasrotated at 10 rpm. Then, the rotation speed was raised to 1,500 rpm toform a uniform layer. The substrate was post-baked at 220° C. for 100minutes to form a top coating layer. Thus, an RGB color filter substratewas obtained.

Formation of Post-ITO Layer

On the above top coating layer, an ITO having a thickness of about 1,300Å was formed by sputtering. At this stage, the color filter substratewas heated to 120° C., while introducing steam and oxygen, to adjust thesurface resistance of the ITO to 20 Ω/cm².

Next, the physical properties of the color filters obtained in the aboveExamples 1 to 8 and Comparative Example 1 were measured as follows.

Measurement Method

The transmittance of the color filter was measured with aspectrophotometer (MCPD-1100: manufactured by Ohtsuka Electronics) usingtramsmittance of a glass substrate as standard. The standard value forthe transmittance was set 450 nm for red, 545 nm for green and 610 nmfor blue. The black matrix was evaluated with a spectrophotometer(MCPD-1100: manufactured by Ohtsuka Electronics) using absorbance. Asabsorbance, the minimum value of the absorbance for each wave length(450 nm to 650 nm) was used as the absorption degree of the black matrix(BMOD). As the absorbance increases, the light shielding rate increases.The high absorbance means better performance of the black matrix.

Further, from the view point of the contrast of the coloring matter thinfilm, the sharpness of the boundary portion between the black matrix(BM) and the coloring matter layers was evaluated. Using the Polaloidphotography from an optical microscope (magnitude: 200 times), in theboundary between the BM and the coloring matter layers, the distancebetween the boundary portion and a point when the optical concentrationbecomes the same as the bulk of the BM or the coloring matter film, wasmeasured. As the distance becomes shorter, the sharpness becomes higher.The uniformity of the thin coloring matter layer was measured from apicture taken by an electron-microscope. From a picture of thecross-sectional structure with magnitude of 3,000 times, the maximumvalue of the surface roughness was measured. Then, the surface roughnesswas standardized by average film thickness. The deficiencies of thecolor filter were indicated by a number of bad picture elements out ofall picture elements.

Further, a taking out electrode having a driver IC in a FPC wasconnected to each color liquid crystal panel, and then the contrast wasmeasured by operating a driving circuit as shown in the followingTable 1. Further, the surface resistance was measured in this situation.Finally, the pencil hardness of the each thin coloring matter film andthe adhesiveness between the glass substrate and the each color filter,were measured.

The adhesiveness was measured by applying celotape (LP-18: manufacturedby Nichiban), making parallel scratched lines with a gap of 1 mm on thecelotape surface, removing the celotape using a snap, and then observingthe appearance of the surface. The results are as shown in Table 1.

                                      TABLE 1                                     __________________________________________________________________________    Color                      Film                                               Filter    Transmittance                                                                         BM Boundary                                                                            Uniform                                                                            Surface    Thin                               Driving   (%)     OD Sharpness                                                                           Flatness                                                                           Resistance Film                               Example                                                                            Circuit                                                                            R  G B  (abs)                                                                            (μm)                                                                             (%)  (Ω/cm.sup.2)                                                                  Contrast                                                                           Hardness                                                                           Adhesiveness                  __________________________________________________________________________    1    MIM  65 62                                                                              58 4.5                                                                              0.1   8    15    46   4H   ◯                 2    MIM  65 65                                                                              56 3.5                                                                              0.2   5    14    23   4H   ◯                 3    MIM  65 60                                                                              55 4.5                                                                              0.1   9    14    45   4H   ◯                 4    MIM  61 58                                                                              52 4.5                                                                              0.3   9    14    38   4H   ◯                 5    MIM  65 61                                                                              54 4.4                                                                              0.1   8    15    40   4H   ⊚              6    MIM  65 61                                                                              55 4.5                                                                              0.1   9    15    45   4H   ⊚              7    MIM  65 61                                                                              55 4.5                                                                              0.1   9    15    45   4H   ◯                 8    TFT  65 61                                                                              55 4.5                                                                              0.1   13   15    85   6H   ⊚              9    TFT  68 65                                                                              68 4.2                                                                              0.1   11   15    95   5H   ◯                 Comp.                                                                              TFT  65 61                                                                              58 2.5                                                                              0.8   18   15    40   4H   ◯                 Example                                                                       __________________________________________________________________________     ⊚: No Delamination Found                                       ◯: A Little Delamination Found                               

Next, the second invention will be described in more detail withreference to the following examples.

Example 10 (Second Invention)

A color filter and a color liquid crystal panel were produced in thefollowing manner.

Formation of Cr Black Matrix

On a soda lime glass substrate which had been subjected to mirrorpolishing treatment (300 mm ×300 mm), silica (SiO₂ ; manufactured byTokyo Ouka: OCDTYPE-7) was coated by sputtering at 1,000 rpm. Afterbaking at 350° C. for 60 minutes, the substrate was cooled to roomtemperature. Then, a chromium thin film having a thickness of about2,000 Å was coated by sputtering on the glass substrate coated withsilica. As a sputtering equipment(SDP-550VT: manufactured by Alback) wasused.

On this substrate, a UV-curable resist material (IC-28/T3: manufacturedby Fuji Hunt Electronics Technology) was coated by spin coating at 1000rpm. After spin coating, the obtained substrate was pre-baked at 80° C.for 15 minutes. Then, this resist/Cr/glass substrate was set in astepper exposure equipment (exposure capacity: 10 mW/cm².S). Thestep-exposure was conducted with a mask, as shown in FIG. 10, preparedby dividing into four pieces a grid pattern and a designed mask forforming taking out electrodes, which have a picture element size of 90μm ×310 μm, a gap of 20 μm and an effective area of 160 mm ×155 mm. Thescanning speed was 5 mm/sec. Then, the development was conducted by analkali developing liquid. After development, the obtained substrate wasrinsed with pure water, and post-baked at 150° C. Thereafter, thechromium on the substrate was subjected to etching treatment with anaqueous solution of 6N HCl/0.1N HNO₃ /0.1N Ce(NO.sub. 3)₄ as a etchingliquid. The ending point of the etching was measured by electricresistance. The etching took about 20 minutes. After etching, thesubstrate was rinsed with pure water and the resist was removed with 1NNaOH. The substrate was sufficiently washed with pure water to completea chromium black matrix and a taking out electrode at the same time.

Formation of Insulating Film and ITO Thin Film

Then, on the above-mentioned chromium black matrix (CrBM), an insulatingresist (CT: manufactured by Fuji Hunt Electronics Technology) was coatedby spin coating at 1,000 rpm. The substrate was baked at 80° C. for 15minutes, and then cooled to room temperature to form an insulating film.

Then, this resist/Cr/glass substrate was set in a stepper exposureequipment. A mask used was prepared by dividing into four pieces apattern having a picture element size of 90 μm ×30 μm (for electrodetaking out window), and an effective area of 300 mm ×300 mm. Theexposure capacity was 10 mW/cm².S and the scanning speed was 5 mm/sec.Then, the development was conducted by an alkali developing liquid. Thedevelopment was conducted for 60 seconds (five times shorter than usual(300 seconds)). As shown in FIG. 12, it was confirmed that the patternwas formed in the taper shape. After development, the obtained substratewas rinsed with pure water, and post-baked at 150° C. for 60 minutes.Then, the substrate was cooled to room temperature to form an insulatingfilm having a taking out electrode window.

Then, on this substrate, an ITO layer having a thickness of about 1300 Åwas coated by sputtering with a sputtering equipment (SDP-550VT:manufactured by Alback). At this stage, the work was heated to 200° C.to adjust the surface resistance of the ITO film to 20 Ω/cm².

On the ITO thin film/insulating film/CrBM/glass substrate, a UV-curableresist material (IC-28/T3: manufactured by Fuji Hunt ElectronicTechnology) was coated by spin coating at 1,000 rpm. After spin coating,the substrate was pre-baked at 80° C. for 15 minutes. Thereafter, theresist/ITO thin film/insulating film/CrBM/glass substrate was set in acontact exposing equipment (exposure capacity: 10 mW/cm².S). A mask usedhad a stripe pattern having a line width of 92 μm, a gap of 18 μm and aline length of 155 mm. As light source, a 2 kW high pressure mercurylamp was used.

After alignment, the substrate was subjected to exposure treatment for15 seconds with a proximity gas of 50 μm. Then, the development wascarried out with an alkali developing liquid. After development, thesubstrate was rinsed and post-baked at 150° C. Thereafter, the above ITOwas subjected to etching treatment with an aqueous solution of 1M FeCl₃/1N HCl/0.1N HNO₃ /0.1N Ce(NO₃)₄ as an etching liquid, to prepare an ITOelectrode. The ending point of the etching was measured by electricresistance. The etching took about 40 minutes. After etching, thesubstrate was rinsed with pure water and the resist was removed with 1NNaOH. Further, the substrate was washed with pure water to complete asubstrate having ITO electrodes (coloring matter layer formingelectrodes). The completion of the substrate was confirmed by checkingthat there is no electric leakage among ITO electrodes.

Formation of Insulating Protection Film In Non-Effective Display Area

An acrylic type resist material (manufactured by Fuji Hunt ElectronicsTechnology) was used as a resist material for forming a taking outelectrode and an insulating protection film for non-effective displayarea. The ITO patterning glass substrate with the Cr black matrixprepared was rotated at 10 rpm, and 30 cc of the above-mentioned resistmaterial were sprayed on the substrate. Then, the rotation speed wasraised to 1,500 rpm to uniformly form a resist layer on the substrate.The substrate was pre-baked at 80° C. for 15 minutes. Then, thesubstrate was subjected to exposure treatment using a mask having adesigned pattern for forming electrode taking out portion 9 and aninsulating protection film for the non-effective display area S (asshown in FIG. 13), while positioning was made by a contact exposingequipment having alignment capability with a 2 kW high pressure mercurylamp. Thereafter, the substrate was developed for 90 seconds with adeveloping liquid to remove the resist material on the electrode takingout portion 9 and the effective display portion S. Further, thesubstrate was rinsed with pure water and post-baked at 180° C. for 100minutes.

According to the above procedures, an insulating protection film wasformed on the substrate for non effective display area and also theelectrode taking out portion 9 was formed at the same time.

Formation of Coloring Matter Layers for Three Primary Colors

To 4L pure water, a ferrocene derivative micelle forming agent, EPEG(manufactured by Dojin Kagaku), LiBr (manufactured by Wako Junyaku) andCHLOMOFUTAL A2B (manufactured by Chiba-Geigy) were added to prepare 2mM, 0.1M, and 10 gl/l solution, respectively. Each of the obtainedsolution was stirred by a ultrasonic homogenizer for 30 minutes toprepare a micelle solution. The above color filter substrate with theITO electrode was immersed in the micelle solution and a potentiostatwas connected to R lines of the stripes. The fixed voltage electrolytictreatment at 0.5 V was conducted to obtain a red coloring matter layer.After washing with pure water, the substrate was pre-baked at 180° C.with an oven. The same procedures for formation of the red coloringmatter layer were repeated to obtain green and blue coloring matterlayers except that 15 g/l of Heliogen Green L9361 (manufactured by BASF)for green, and 9 g/l of Heliogen Blue K7080 (manufactured by BASF) forblue were used. Thus, RGB coloring matter layers were obtained.

In addition, it was confirmed that no leakage and braking off of lineswere found at the time of the electricity passing treatment, and thecoloring matter layer forming electrode (ITO electrode) and the takingout electrode were connected without pin holes.

Formation of Top Coating Layer

Then, 30 cc of a top coating material (OS-808: manufactured by Nagase)were sprayed on the prepared color dividing filter substrate, while thesubstrate was rotated at 10 rpm. Then, the rotation speed was raised to15,000 rpm to form a uniform layer. The substrate was post-baked at 260°C. for 100 minutes to form a top coating layer. Thus, a top coating film(flattening film) was formed on the coloring matter layer for RGB threeprimary colors.

Formation of Liquid Crystal Driving Electrode (Post-ITO Electrode)

On the above top coating film, an ITO film having a thickness of about1,300 Å was formed by sputtering with a sputtering equipment (SDP-550VT:manufactured by Alback). At this stage, the color filter substrate washeated to 120° C., while introducing steam and oxygen, to adjust thesurface resistance of the ITO film to 20 Ω/cm².

Then, on the ITO film formed substrate, a UV-curable resist material(IC-28/T3: manufactured by Fuji Hunt Electronics Technology) was coatedby spin coating at 1,000 rpm. After spin coating, the substrate waspre-baked at 80° C. for 15 minutes. Thereafter, the substrate was set ina contact exposing equipment (exposure capacity: 10 mW/cm².S). A maskused had a stripe pattern (vertical to the stripe pattern for forming ablack matrix) having a line width of 312 μm, a gap of 18 μm and a linelength of 175 mm. As light source, a 2 kW high pressure mercury lamp wasused. After alignment, the substrate was subjected to exposure treatmentfor 15 seconds with a proximity gas of 50 μm. Then, the development wascarried out with an alkali developing liquid. After development, thesubstrate was rinsed with pure water and post-baked at 180° C.Thereafter, the above ITO film on the substrate was subjected to etchingtreatment with an aqueous solution of 1M FeCl₃ /1N HCl/0.1N HNO₃ /0.1NCe(NO₃)₄ as an etching liquid. The ending point of the etching wasmeasured by electric resistance. The etching took about 23 minutes.After etching, the substrate was rinsed with pure water and the resistwas removed with 1N NaOH. Thus, the patterning of the ITO was completedto obtain a color filter for STN or MIM.

Production of Color Liquid Crystal Display (Panel)

On the surface of the color filter substrate prepared as above, apolyamic acid resin monomer was coated by spin coating. The monomer wascured at 250° C. for 1 hour to obtain a polyimide resin, and thensubjected to rubbing treatment. As counter electrode, a polyamic acidresin monomer was coated by spin coating on the ITO glass substrate witha MIM driving circuit. The monomer was cured at 250° C. for 1 hour toobtain a polyimide resin. After rubbing was made, between (liquidcrystal) the above color filter substrate and the glass substrate with aMIM driving circuit, glass beads and a TN liquid crystal were insertedin this order, and encapsulated by adhesive to complete a color liquidcrystal display (panel).

To the color liquid crystal panel, a taking out electrode having adriving IC on the FPC was connected, and polarization plates were bondedto the both side. The operation of the liquid crystal was confirmed bydriving the obtained MIM driving circuit.

INDUSTRIAL APPLICABILITY

The above-mentioned color filter or color liquid crystal displayaccording to the present invention, can be preferably used as a colorliquid crystal display for a personal computer, a lap-top personalcomputer, a note-type personal computer, a word processor, a wallhanging TV, a liquid crystal TV or the like; a color filter for anaurora vision, CCD or the like; or a color display for an audioequipment, an interior panel for automotive, a watch, a clock, acalculator, a video deck, a facsimile, a communication equipment, a gamemachine, a measurement equipment or the like.

We claim:
 1. A color filter comprising a metal black matrix, aninsulating film, a transparent electrodes, a coloring matter layer and apost-ITO layer above the coloring matter layer, laminated in this order,on one side of an insulating substrate, said post-ITO layer beingsubjected to patterning.
 2. A color filter according to claim 1, whereinthe metal black matrix is composed of chromium or nickel.
 3. A colorfilter according to claim 1, wherein the insulating film is composed ofsilica, titania or alumina.
 4. A color filter according to claim 1,wherein the insulating film is composed of an insulating polymer.
 5. Acolor liquid crystal display comprising, the color filter set forth inclaim 1, an electrode substrate for driving a liquid crystal and theliquid crystal encapsulated between them so that the transparentelectrode for forming the coloring matter layer is used as an electrodefor driving the liquid crystal.
 6. A color filter according to claim 1,further comprising a top coating layer between the coloring matter layerand the post-ITO layer.
 7. A color filter prepared by laminating, inthis order, a black matrix and a taking out electrode, an insulatingfilm having a window for said taking out electrode, a transparentelectrode for forming a coloring matter layer, an insulating protectionlayer, said coloring matter layer, a flattening film and an electrodefor driving a liquid crystal on an insulating substrate, wherein saidtaking out electrode and said transparent electrode for forming acoloring matter layer are electrically connected through said window forsaid taking out electrode.
 8. A color filter according to claim 2,wherein the black matrix and the taking out electrode are simultaneouslyformed on the insulating substrate with use of a light-shielding film.9. A color filter according to claim 7, wherein the insulating film ismade of a resist material composed of at least one resin selected froman acrylic resin having sensitivity to a ultra-violet ray, an epoxyresin and a siloxane resin.
 10. A process for producing a color filtercomprising forming and laminating, in this order, a black matrix and ataking out electrode, an insulating film having a window for said takingout electrode; forming a transparent electrode for forming a coloringmatter layer on the insulating layer in such manner that the transparentelectrode can be electrically connected to the taking out electrodethrough the window for said taking out electrode; and then forming saidcoloring matter layer by passing electricity to the transparentelectrode for forming the coloring matter layer through the taking outelectrode.
 11. A process for producing a color filter according to claim10, wherein a film of said transparent electrode material is formed onan entire surface of the insulating layer to make electrical contactbetween the taking out electrode and the film made of the transparentelectrode material, and then the film made of the transparent electrodematerial is subjected to patterning by a photo-lithography method toform the transparent electrode for forming the coloring matter layer.12. A process for producing a color filter according to claim 10,wherein an insulating protection film is formed on the portion of thesubstrate for non-effective display area, said substrate having thetransparent electrode for forming said coloring matter layer, and thensaid coloring matter layer is formed by passing electricity.
 13. Aprocess for producing a color filter according to claim 10, whereindevelopment time for the photo-lithography treatment is controlled toform a periphery portion of the taking out electrode window of theinsulating film in a tapered shape.
 14. A process for producing a colorfilter according to claim 10, wherein the insulating film is made of aresist material composed of at least one resin selected from an acrylicresin having sensitivity to a ultra-violet ray, an epoxy resin and asiloxane resin.
 15. A process for producing a color filter according toclaim 10, wherein said coloring matter layer is formed by passingelectricity to the taking out electrode which is electrically connectedto the transparent electrode, by way of a micellar disruption method oran electro-deposition method.